![Polymers | Free Full-Text | Molecular Dynamics Simulation and Experimental Studies on the Thermomechanical Properties of Epoxy Resin with Different Anhydride Curing Agents Polymers | Free Full-Text | Molecular Dynamics Simulation and Experimental Studies on the Thermomechanical Properties of Epoxy Resin with Different Anhydride Curing Agents](https://www.mdpi.com/polymers/polymers-11-00975/article_deploy/html/images/polymers-11-00975-g001-550.jpg)
Polymers | Free Full-Text | Molecular Dynamics Simulation and Experimental Studies on the Thermomechanical Properties of Epoxy Resin with Different Anhydride Curing Agents
![Decomposition behavior and mechanism of epoxy resin from waste integrated circuits under supercritical water condition - ScienceDirect Decomposition behavior and mechanism of epoxy resin from waste integrated circuits under supercritical water condition - ScienceDirect](https://ars.els-cdn.com/content/image/1-s2.0-S030438941930456X-gr5.jpg)
Decomposition behavior and mechanism of epoxy resin from waste integrated circuits under supercritical water condition - ScienceDirect
Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide - RSC Advances (RSC Publishing)
![Coatings | Free Full-Text | Cure Kinetics of Commercial Epoxy-Amine Products with Iso-Conversional Methods Coatings | Free Full-Text | Cure Kinetics of Commercial Epoxy-Amine Products with Iso-Conversional Methods](https://www.mdpi.com/coatings/coatings-13-00592/article_deploy/html/images/coatings-13-00592-g001-550.jpg)
Coatings | Free Full-Text | Cure Kinetics of Commercial Epoxy-Amine Products with Iso-Conversional Methods
![Figure 4 from Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin cured with different curing agents | Semantic Scholar Figure 4 from Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin cured with different curing agents | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/71f89c58a9dfe7b9c7665fe6b1b7869a6f7c666c/3-Figure4-1.png)
Figure 4 from Curing mechanism and thermal properties of a certain liquid crystalline epoxy resin cured with different curing agents | Semantic Scholar
Using Dicyclopentadiene-Derived Polyarylates as Epoxy Curing Agents To Achieve High Tg and Low Dielectric Epoxy Thermosets | ACS Omega
![Two-Step Curing Reaction of Epoxy Resin Studied by Thermal Analysis and Infrared Spectroscopy - Hideki Yamasaki, Shigeaki Morita, 2012 Two-Step Curing Reaction of Epoxy Resin Studied by Thermal Analysis and Infrared Spectroscopy - Hideki Yamasaki, Shigeaki Morita, 2012](https://journals.sagepub.com/cms/10.1366/11-06437/asset/images/large/10.1366_11-06437-fig10.jpeg)
Two-Step Curing Reaction of Epoxy Resin Studied by Thermal Analysis and Infrared Spectroscopy - Hideki Yamasaki, Shigeaki Morita, 2012
![Analysis of the reaction mechanism of the thiol–epoxy addition initiated by nucleophilic tertiary amines - ScienceDirect Analysis of the reaction mechanism of the thiol–epoxy addition initiated by nucleophilic tertiary amines - ScienceDirect](https://ars.els-cdn.com/content/image/1-s2.0-S1759995422054808-c7py01263b-s1.jpg)
Analysis of the reaction mechanism of the thiol–epoxy addition initiated by nucleophilic tertiary amines - ScienceDirect
![Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite | SpringerLink Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite | SpringerLink](https://media.springernature.com/lw685/springer-static/image/art%3A10.1007%2Fs10904-019-01290-1/MediaObjects/10904_2019_1290_Fig1_HTML.png)